WEB 6th Generation Ceramic Packaging via ULTCC Sustainable ConceptThursday (24.09.2020) 15:40 - 15:55 F: Functional Materials, Surfaces, and Devices 1 Part of:
Materials are the basic building blocks of every active technology device today and in the future. Due to the increasing population of electroceramic packaging wastages and its recycling energy regulations are increasing significantly from the last two decades because of the growth of multilayer ceramic technology (HTCC (fabrication temperature:1000 -1600 ℃) - LTCC (fabrication temperature: 700 - 960 ℃)) applications and market productions. The 5G telecommunication devices are the way to global standards with existing HTCC and LTCC packaging technology. Herein, we direct the future packaging strategies for 2030's i. e, the 6th generation electroceramic packaging idea on ULTCC technology by offering the fabrication temperature (200-700 ℃) beyond the HTCC and LTCC boundary. Till the end of 2019, the research topic on ULTCC is limited to academic research with the advancement of materials and few multilayer substrate inventions. At the beginning of the 2020s, Fraunhofer IKTS intended to build a bridge linking academics and ceramic industries to develop the future 6G electroceramic packaging based upon the ultimate sustainable orbicular economy. Within, we present material technology by glass-ceramics design rules, sustainable and low melting organics for tape casting based on RoHS and integration of active and passive parts for applications such as sensors, high-frequency devices, and power electronic modules.
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