Efficiency Improvement of Actively Antimicrobial Metallic Surfaces by Ultrashort Pulsed Direct Laser Interference Patterning
The dissemination of antibiotic resistant germs is giving rise to a higher risk of infection, as well as a more critical course of disease in many public facilities, where a transfer takes place due to a deposition and receiving of germs via contact areas. A promising method to eliminate this potential route of transfer is the use of actively antimicrobial metallic materials utilizing copper and its alloys as inherent agents or full metal contact surfaces.
Hence, the antimicrobial capacity of these contact surfaces was determined solely by the Copper content focusing the chemical effect on the germs. An additional enhancement of the potential antimicrobial properties can also be made by tailoring the surface topography according to the physiology of the bacteria to enable a larger contact area to the toxic substrate and higher metabolic activity. Line patterns with different structural features were applied on copper surfaces by ultrashort pulsed Direct Laser Interference Patterning (USP-DLIP) adapting the chemical as well as the topographical surface properties. By this a significant reduction in bacterial viability was achieved aside of reduced wettability in relation to flat polished surfaces, where both properties could be linked to a delicate interplay of topographical and chemical surface modifications by USP-DLIP. Thereby, it was shown that both properties do not only appear independently but have a complementary effect.
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