Tailored Functionalization of Copper Surfaces by Ultrashort Pulsed Direct Laser Interference Patterning
Surface structures in the micro- and nanometer range have a great influence on the performance and functionality of many specialized applications in surface technology. In addition to topographic properties, chemical aspects also play a major role in most of these cases. Good examples are biomimetic surface patterns that change both the wettability and the adhesion of cells and/or bacteria. Reduced wettability predominantly requires specific surface chemistry which properties are additionally propelled by topographic asperities while cell and bacterial adhesion is primarily influenced by the topography and secondarily by chemistry.
To achieve optimal results in surface functionalization, it is important to understand the complex relation between surface morphology and chemistry and the utilized processing methodology. In this context we present a study on the details behind the functionalization of copper surfaces by Ultrashort Pulsed Direct Laser Interference Patterning (USP-DLIP), where the modification of topographic and chemical surface parameters during processing are closely explored in relation to both of the aforementioned applications. Fundamental processes, such as the mutual transition from Wenzel to Cassie-Baxter wetting, but also enhanced antibacterial properties of the copper surfaces could be traced back to specific process-related surface modifications. By this, we were able to show how the specific material interaction on USP-DLIP can be used to benefit surface functionalization in both applications and therefore enhance the effect of the surface treatment.